dmp102 2 ufd f d atasheet number: ds 36624 rev. 3 - 2 1 of 6 www.d iodes.com march 2014 ? diodes incorporated dm p102 2 uf d f new product 12v p - channel enhancement mode mosfet product summary v (br)dss r ds(on) max i d max t a = + 25c - 12 v 1 5.3 m ? gs = - 4.5v - 9. 5 a 19 m? @ v gs = - 2.5v - 8.5 a 26 .5 m ? @ v gs = - 1.8 v - 7. 2a 32 m ? @ v gs = - 1.5 v - 6. 6a description this mosfe t has been designed specifically for use in battery management applications. features ? C ? 2 ? ? ? ? totally lead - free & fully rohs c ompliant (note s 1 & 2 ) ? halogen and antimony free. green device (note 3 ) ? qualified to aec - q101 standards for high reliability mechanical data ? ? case material: molded plastic, green molding compound. ? ? C ? ordering information (not e 4 ) part number marking reel s ize (inches) quantity per r eel dmp1 0 2 2 u fd f - 7 p u 7 3,000 dmp102 2 ufd f - 13 p u 13 10 ,000 note s: 1 . no purposely added lead. fully eu directive 2002/95/ec (rohs) & 2011/65/eu (rohs 2) compliant. 2. see http://www.diodes.com/q uality/lead_free.html for more information about diodes incorporateds definitions of hal ogen - and antimony - free, "green" and lead - f ree . 3. halogen - and antimony - free "green products are defined as those which contain <900ppm bromine, <900ppm chlori ne (<1500ppm total br + cl) and <1000ppm antimony compounds. 4 . for packaging details, go to our website at http://www.diodes.com /products/packages.html . marking information date code key year 2011 2012 2013 2014 2015 201 6 201 7 code y z a b c d e month jan feb mar apr may jun jul aug sep oct nov dec code 1 2 3 4 5 6 7 8 9 o n d pin out internal schematic p u = product type marking code ym = date code marking y = year (ex: a = 201 3 ) m = month (ex: 9 = september) u - dfn2020 - 6 bottom view p u y m bottom view top view e4 d s g g ate protection diode esd protected
dmp102 2 ufd f d atasheet number: ds 36624 rev. 3 - 2 2 of 6 www.d iodes.com march 2014 ? diodes incorporated dm p102 2 uf d f new product maximum ratings ( @t a = + 25c , unless otherwise specified .) characteristic symbol value units drain - source voltage v dss - 12 v gate - source voltage v g ss 8 v continuous drain current (note 6 ) v gs = - 4.5 v steady state t a = +25c t a = +70c i d - 9.5 - 7.6 a t<5s t a = +25c t a = +70c i d - 11.0 - 8.8 a pulsed drain curren t ( 10 dm - 90 a continuous source - drain diode current t a = + 25c t c = + 25 c i s - 2.5 - 7.1 a pulsed source - drain diode c urrent ( 10s pulse, duty cycle = 1% sm - 50 a thermal characteristics characteristic symbol value units tota l power dissipation (note 5) t a = +25c p d 0.73 w t a = +70c 0.47 thermal resistance, junction to ambient (note 5) s teady state r ja 172 c/w t<5s 128 total power dissipation (note 6 ) t a = +25c p d 2.1 w t a = +70c 1.3 thermal resistance, ju nction to ambient (note 6 ) s teady state r ja 59 c/w t<5s 45 thermal resistance, junction to case (note 6 ) s teady state r j c 5.1 operating and storage temperature range t j, t stg - 55 to +150 c electrical characteristics ( @t a = +25c, unless otherwise specified.) characteristic symbol mi n typ max unit test condition off characteristics ( note 7 ) drain - source breakdown voltage bv dss - 12 gs = 0v, i d = - 250 a j = +25c i dss ds = - 12 v, v gs = 0v gate - source leakage i gss gs = 8 v, v ds = 0v on characteristics ( note 7 ) gate threshold voltage v gs(th) - 0. 35 ds = v gs , i d = - 250 a ds (on) ? gs = - 4. 5 v, i d = - 4a 15 19 v gs = - 2.5v, i d = - 4a 20 26.5 v gs = - 1.8v, i d = - 4a 23 32 v gs = - 1. 5 v, i d = - 2a diode forward voltage v sd gs = 0v, i s = - 8 a dynamic character istic s (note 8 ) input capacitance c iss ds = - 10 v, v gs = 0v , f = 1.0mhz output capacitance c oss rss g ? ds = 0 v, v gs = 0v , f = 1mhz total gate charge q g gs = - 8 v, v ds = - 6v , i d = - 1 0 a total gate charge q g gs = - 4.5 v, v ds = - 6 v, i d = - 1 0 a gate - source charge q gs gd d(on) ds = - 6 v, v g s = - 4.5 v, r g = 1 d = - 8 a turn - on rise time t r d(off) f notes: 5. device mounted on fr - 4 pc board, with minimum recommended pad layout, single sided. 6. device mounted on fr - 4 substrate pc board, 2 oz copper, with thermal v ias to bottom layer 1inch square copper plate 7 . short duration pulse test used to minimize self - heating effect 8 . guaranteed by design. not subject to production testing
dmp102 2 ufd f d atasheet number: ds 36624 rev. 3 - 2 3 of 6 www.d iodes.com march 2014 ? diodes incorporated dm p102 2 uf d f new product 0 5 10 15 20 25 30 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 -v , drain -source voltage (v) figure 1 typical output characteristics ds - i , d r a i n c u r r e n t ( a ) d v = -2.0v gs v = -2.5v gs v = -8.0v gs v = -4.5v gs v = -1.2v gs v = -1.5v gs v = -1.8v gs 0.5 0.7 0.9 1.1 1.3 1.5 1.7 -50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) j ? figure 5 on-resistance variation with temperature r , d r a i n - s o u r c e o n - r e s i s t a n c e ( n o r m a l i z e d ) d s ( o n ) v = -4.5v i = -10a gs d v = -2.5v i = -5a gs d 0 0.01 0.02 0.03 0.04 0.05 0.06 0 5 10 15 20 25 30 -i , drain source current (a) figure 3 typical on-resistance vs. drain current and gate voltage d r , d r a i n - s o u r c e o n - r e s i s t a n c e ( ) d s ( o n ) ? v = -1.5v gs v = -1.8v gs v = -2.5v gs v = -4.5v gs 0 4 8 12 16 20 0 0.5 1 1.5 2 2.5 3 -v , gate-source voltage (v) gs figure 2 typical transfer characteristics - i , d r a i n c u r r e n t ( a ) d t = 150 c a ? t = 125 c a ? t = 85 c a ? t = 25 c a ? t = -55 c a ? v = -5.0v ds 0 0.005 0.01 0.015 0.02 0.025 0.03 0 4 8 12 16 20 -i , drain source current (a) figure 4 typical on-resistance vs. drain current and temperature d r , d r a i n - s o u r c e o n - r e s i s t a n c e ( ) d s ( o n ) ? t = -55 c a ? t = 25 c a ? t = 85 c a ? t = 150 c a ? v = -4.5v gs t = 125 c a ? 0 0.01 0.02 0.03 0.04 -50 -25 0 25 50 75 100 125 150 t , junction temperature ( c) j ? figure 6 on-resistance variation with temperature v = -4.5v i = a gs d -10 v = 5v i = a gs d -2. -5 r , d r a i n - s o u r c e o n - r e s i s t a n c e ( ) d s ( o n ) ?
dmp102 2 ufd f d atasheet number: ds 36624 rev. 3 - 2 4 of 6 www.d iodes.com march 2014 ? diodes incorporated dm p102 2 uf d f new product 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -50 -25 0 25 50 75 100 125 150 t , ambient temperature (c) figure 7 gate threshold variation vs. ambient temperature a v , g a t e t h r e s h o l d v o l t a g e ( v ) g s ( t h ) -i = 1ma d -i = 250a d 0 4 8 12 16 20 0.4 0.6 0.8 1 1.2 -v , source-drain voltage (v) figure 8 diode forward voltage vs. current sd - i , s o u r c e c u r r e n t ( a ) s t = 25 c a ? 0 2 4 6 8 0 5 10 15 20 25 30 35 40 45 50 q , total gate charge (nc) figure 10 gate-charge characteristics g - v , g a t e - s o u r c e v o l t a g e ( v ) g s v = -6v i = -10a ds d 0 500 1000 1500 2000 2500 3000 3500 4000 0 3 6 9 12 15 c , j u n c t i o n c a p a c i t a n c e ( p f ) t -v , drain-source voltage (v) figure 9 typical junction capacitance ds c oss c rss f = 1mhz c iss 0.001 0.01 0.1 1 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000 t1, pulse duration times (sec) figure 11 transient thermal resistance r ( t ) , t r a n s i e n t t h e r m a l r e s i s t a n c e d = 0.7 d = 0.9 d = 0.5 d = 0.3 d = 0.1 d = 0.05 d = 0.02 d = 0.01 d = 0.005 single pulse r (t) = r(t) * r r = 172c/w duty cycle, d = t1/ t2 ?? ? ja ja ja
dmp102 2 ufd f d atasheet number: ds 36624 rev. 3 - 2 5 of 6 www.d iodes.com march 2014 ? diodes incorporated dm p102 2 uf d f new product package outline dimensions please see ap02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. suggested pad layout please see ap0200 1 at http://www.diodes.com/datasheets/ap0200 1 .pdf for latest version. u - dfn 2 0 20 - 6 dim min max typ a 0.57 ? ? a1 0 0.05 0.0 3 a3 - - 0.15 b 0.2 5 0.3 5 0. 30 d 1. 95 2.05 2.00 d2 0.85 1. 05 0.95 d 3 0.33 0.43 0.38 e 0. 65 bsc e2 0. 863 bsc e 1.95 2.05 2.00 e2 1.05 1.25 1.15 e 3 0.65 0.75 0.70 l 0. 225 0. 32 5 0. 275 z 0.20 bsc z1 0.110 bsc all dimensions in mm dimensions value (in mm) c 0.650 x 0.400 x1 0.480 x2 0.950 x3 1.700 y 0.425 y1 0.800 y2 1.150 y3 1.450 y4 2.300 pin1 y4 y2 y x c x3 y1 x1 x2 y3 d d2 e e b l e2 a a3 seating plane a1 z(4x) e2 e3 d3 z1
dmp102 2 ufd f d atasheet number: ds 36624 rev. 3 - 2 6 of 6 www.d iodes.com march 2014 ? diodes incorporated dm p102 2 uf d f new product important notice diodes incorporated makes no warranty of any kind, express or implied, with regards to this document, including, but not limited to, the implied warranties of merchant ability and fitness for a particular purpose (and their equivalents under the laws of any jurisdiction). diodes incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without f urther notice to this document and any product described herein. diodes incorporated does not assume any liability arising ou t of the application or use of this document or any product described herein; neither does diodes incorporated convey any license u nder its patent or trademark rights, nor the rights of others. any customer or user of this document or products described herein in such appli cations shall assume all risks of such use and will agree to hold diodes incorporated and all the companies whos e products are represented on diodes incorporated website, harmless against all damages. diodes incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthor ized sales channel. should customers pu rchase or use diodes incorporated products for any unintended or unauthorized application, customers shall indemnify and hold diodes incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly o r indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. products described herein may be covered by one or more united states, international or foreign patents pending. product nam es and markings n oted herein may also be covered by one or more united states, international or foreign trademarks. this document is written in english but may be translated into multiple languages for reference. only the english version of this document is the final and determinative format released by diodes incorporated. life support diodes incorporated products are specifically not authorized for use as critical components in life support devices or system s without the express written approval of the chief executive officer of diodes incorporated. as used herein: a. life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance wi th instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. b. a critical component is any component in a life support device or system whose failure to perform can be reasonably expe cte d to cause the failure of the life support device or to affect its safety or effectiveness. customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowl edge and agree that they are solely responsible for all legal, regulatory and safety - related requirements concerning their products and any use of diodes incorporated products in such safety - critical, life support devices or systems, notwithstanding any de vices - or systems - related information or support that may be provided by diodes incorporated. further, customers must fully indemnify diodes incorpora ted and its representatives against any damages arising out of the use of diodes incorporated products in such safety - critical, life support devices or systems. copyright ? 201 4 , diodes incorporated www.diodes.com
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